Packaging Engineer Job Listing at AMD in 新竹市 (Job ID 70823-en-us)

Description

WHAT YOU DO AT AMD CHANGES EVERYTHING

We care deeply about transforming lives with AMD technology to enrich our industry, our communities, and the world. Our mission is to build great products that accelerate next-generation computing experiences – the building blocks for the data center, artificial intelligence, PCs, gaming and embedded. Underpinning our mission is the AMD culture. We push the limits of innovation to solve the world's most important challenges. We strive for execution excellence while being direct, humble, collaborative, and inclusive of diverse perspectives. 

AMD together we advance_

THE ROLE:

Being in External Manufacturing Operations (Backend Engineering), candidate is required to drive supplier engagement with external manufacturer on delivering key performance indices in terms of Program Management, New Product Introduction, Supplier Manufacturing readiness, Excursion free processes, Enabling new capabilities and Value Engineering activities.

THE PERSON:

The successful candidates must be a team player with a commitment to meet deadlines/lead & drive value engineering initiative & work in a fast-paced multi-tasking environment. He or she would have excellent cross-functional project management skills, conflict management skills, with strong interpersonal skills, good executive presentation & communication skills. Demonstrating strong leadership to excel in his/her work with minimum supervision.

KEY RESPONSIBILITIES:

• Drive supplier engagement on continuous improvement, new capabilities ahead of need and value engineering activities.
• Plan and drive for New Product Introduction activities and Ramp Up readiness with external manufacturing partners and AMD internal stakeholders.
• Drive external manufacturer on issue resolution and issue prevention.
• Plan and execute change management /value engineering from internal or external parties.
• Work cross-functionally to develop project schedules, budgets, technical deliverables and monitor progress to ensure goals are met.
• Produce executive reporting to management.
• Involve in regional supplier management.
• Overseas travelling as required.
• Assist in additional duties as deemed fit by supervisor.

PREFERRED EXPERIENCE:

• Strong knowledge in Advanced Packaging (2.5D, CoWoS, EFB, Flip Chip) and/or substrate manufacturing processes.
• Good knowledge in Semiconductor Packaging Materials and/or Thermal solutions have added advantages.
• Track record of supplier management and drive project management (change management/cost saving).
• Good leadership, executive communication and interpersonal relationships.
• Familiar with tools (JMP, Power BI, failure analysis knowledge, package reliability knowledge) and industry standard (ESD, Jedec, Automotive).

ACADEMIC CREDENTIALS:

• Bachelor/MS degree in Mechanical or Material or Chemical Engineering.
• Good working experience in Backend Semiconductor.
• Fluent in Mandarin and English both oral and written.

LOCATION:

Hsinchu, Taiwan

• #LI-SC1

Benefits offered are described:  AMD benefits at a glance.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law.   We encourage applications from all qualified candidates and will accommodate applicants' needs under the respective laws throughout all stages of the recruitment and selection process.