Packaging Engineer Job Listing at AMD in Suzhou, Anhui (Job ID 75780-en-us)

Description

WHAT YOU DO AT AMD CHANGES EVERYTHING 

At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you'll discover the real differentiator is our culture. We push the limits of innovation to solve the world's most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond.  Together, we advance your career.  

THE ROLE:

Candidates working in External Manufacturing Operations (Backend Engineering) are expected to actively engage suppliers and external manufacturers to achieve critical performance goals. These include project management, successful new product introductions, ensuring supplier manufacturing readiness, maintaining processes free from excursions, and fostering new capabilities.   

THE PERSON:

Successful candidates should be collaborative team players who are dedicated to meeting deadlines, leading initiatives, and driving solutions. They must thrive in fast-paced, multi-tasking environments and possess strong project management and conflict resolution skills across functions. Excellent interpersonal abilities, effective executive presentation, and communication skills are essential. Additionally, they should demonstrate strong leadership and work independently with minimal supervision.

KEY RESPONSIBILITIES:

• Drive for supplier engagement on continuous improvement and new capabilities ahead of need.
• Plan and drive for New Product Introduction activities and Ramp Up readiness with external manufacturing partners and AMD internal stakeholders.
• Drive external manufacturer on issue resolution and issue prevention
• Plan and execute change management from internal or external parties.
• Involve in regional supplier management.
• Overseas travelling as required.
• Assist in additional duties as deemed fit by supervisor.

PREFERRED EXPERIENCE:

• Strong knowledge in Flip Chip Packaging (with operational experience in bumping process, Assembly manufacturing is added advantage)
• Track record of development work leading to volume production in Semiconductor manufacturing.
• Good leadership and interpersonal relationship.
• Familiar with tools (JMP, minitab, failure analysis knowledges, package reliability knowledges) and industry standard (ESD, Jedec, Automotive).
• Proven project management experience with technical understanding, and a track record of successfully applying project management knowledge to deliver complex projects.
• Good English speaking, communication, and writing skills.

ACADEMIC CREDENTIALS:

• Bachelor/MS degree in Mechanical or Material Engineering
• 5 years of working experience in Backend Semiconductor

LOCATION:

Suzhou, China

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Benefits offered are described:  AMD benefits at a glance.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law.   We encourage applications from all qualified candidates and will accommodate applicants' needs under the respective laws throughout all stages of the recruitment and selection process.