Description
WHAT YOU DO AT AMD CHANGES EVERYTHING
We care deeply about transforming lives with AMD technology to enrich our industry, our communities, and the world. Our mission is to build great products that accelerate next-generation computing experiences – the building blocks for the data center, artificial intelligence, PCs, gaming and embedded. Underpinning our mission is the AMD culture. We push the limits of innovation to solve the world's most important challenges. We strive for execution excellence while being direct, humble, collaborative, and inclusive of diverse perspectives.
AMD together we advance_
PROGRAM TERM: Jan 1, 2025 to Jun 30, 2025
LOCATION: Taichung(Major)/Taoyuan
ONSITE/HYBRID: These roles require the student to work a minimum of 24 hours per week (3 days), required onsite throughout the duration of the co-op/intern term.
WHAT YOU'LL BE DOING:
As an intern you will be part of AMD's advanced package technology and engineering group within AMD's Adaptive and Embedded Computing Group (AECG). You will develop capabilities to help analyze & automate packaging yield & defect metrics to improve the yield of advanced IC packages for our state-of-the-art semiconductor products. You will help analyze the yield metrics and assist the package engineering team to set up key process indicators to access the effectiveness of yield improvement actions. You will work closely with the San Jose and Taiwan package engineering teams and key package & assembly suppliers in the analysis of the yield data. In addition, you will work with package engineering team on following up NPI development and key projects schedule to ensure project on time and success. Also, you will help to revise key package documentation for assembly bill of material changes and will analyze and help automate packaging data bases.
KEY QUALIFICATIONS:
- Python, SQL, HTML, JMP proficiency preferred
- Data Analytics, Data Mining experience
- AutoCAD/Excel/PowerPoint proficiency preferred
- Knowledge of Packaging Technology, F/A techniques preferred
PLEASE HAVE KNOWLEGES OF ONE OR MORE OF THE FOLLOWING TECHNICAL SKILLS:
- Python programming
- SQL Server data platform
- Power BI
- JMP analysis
- Semiconductor packaging processes or materials
WHO WE'RE LOOKING FOR:
- Currently enrolled in accredited Taiwan university, preferable in master's degree
- Studying Material Science Engineering, Mechanical Engineering, Electrical Engineering, Chemical Engineering
- Curious, creative, proactively, well organized, good team player and multi-tasker
- High self-learning and self-motivation skills
#LI-SH2
Benefits offered are described: AMD benefits at a glance.
AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants' needs under the respective laws throughout all stages of the recruitment and selection process.
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