Silicon Design Engineer Job Listing at AMD in Taipei City (Job ID 76526-en-us)

Description

WHAT YOU DO AT AMD CHANGES EVERYTHING 

At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you'll discover the real differentiator is our culture. We push the limits of innovation to solve the world's most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond.  Together, we advance your career.  

THE ROLE: 

We are seeking a senior-level manufacturing technology expert to lead board-level SMT assembly process development for advanced computing platforms. This role is a technology development and process authority position - not production support. The successful candidate will define assembly strategies, influence design decisions, and enable manufacturability for next-generation products that push the limits of conventional SMT capability.

You will work at the intersection of package engineering, PCB design, mechanical and thermal integration, reliability, and global manufacturing, setting standards and best practices deployed across multiple manufacturing partners worldwide.

This role offers the opportunity to define manufacturing capability for future platforms, influence product architecture, and solve board-assembly problems that do not have textbook answers. Success is measured by enabling designs that others consider too complex to manufacture reliably.

THE PERSON:

• Establishes repeatable, high-yield SMT assembly processes for mechanically and thermally demanding PCB assemblies.
• Translates warpage/coplanarity and thermal behavior into clear, manufacturable design rules and process windows.
• Enables smooth transition from engineering builds to high-volume manufacturing across global partners.
• Creates scalable guidelines and training that raise capability across internal teams and contract manufacturers.
  
  

KEY RESPONSIBLITIES:

• Advanced SMT Process Development
  • Lead development, optimization, and qualification of end-to-end SMT processes (printing, placement, reflow, and post-reflow stabilization).
  • Define robust process windows balancing yield, reliability, and scalability across global manufacturing environments.
  • Drive structured experimentation (DOE) and statistical process control to solve complex yield and reliability challenges.
• Large BGA Assembly, Warpage and Coplanarity Mitigation
  • Serve as technical owner for assembly of large, mechanically challenging BGA packages and complex board constructions.
  • Develop measurement and correlation methodologies for warpage/coplanarity across room temperature, reflow, and post-assembly conditions.
  • Translate empirical data into actionable controls: stencil strategy, placement approach, reflow profile optimization, and board support concepts.
  • Define practical coplanarity and interface-gap limits based on real manufacturing capability.
• Stencil, Paste Deposition, and Defect Reduction
  • Define stencil design guidelines for mixed-technology assemblies (thickness selection, aperture optimization, via-in-pad approaches, paste volume control).
  • Lead strategies to reduce defects including insufficient solder, head-in-pillow, bridging, and voiding.
  • Partner with suppliers to evaluate solder paste materials, flux systems, and stencil fabrication technologies.
• Placement Strategy and Equipment Capability
  • Define placement process requirements for challenging components: placement force/speed, nozzle and vacuum strategy, and fixturing/support concepts.
  • Work directly with equipment vendors and manufacturing partners to qualify placement capability and drive tool enhancements when required.
• Reflow Technology and Thermal Profiling
  • Architect reflow strategies for assemblies with high thermal mass and uneven heat distribution.
  • Develop profiling methodologies to control thermal gradients across boards and complex component populations.
  • Lead evaluation and deployment of advanced reflow technologies (e.g., vacuum and inert-atmosphere reflow) to improve solder joint integrity and void performance.
  • Define requirements for custom or modified equipment when standard solutions are insufficient.
• Thermal Mechanical Solution Robustness and Post-SMT Processes
  • Define and qualify edge bonding and underfill strategies to improve mechanical shock, vibration, and board-level reliability.
  • Develop manufacturable processes for mechanical and thermal hardware integration (heatsinks, clamping, thermal interface materials).
  • Evaluate mechanical stress transfer to solder joints and ensure processes are repeatable and auditable.
• BGA Rework and Repair Strategy
  • Develop controlled rework methodologies for complex BGA assemblies, including safe removal/replacement processes.
  • Ensure reworked assemblies meet full quality and reliability requirements through defined acceptance criteria and verification methods.
• DFM Leadership and Assembly Guidelines
  • Lead DFM reviews for advanced PCB designs: land patterns, via-in-pad structures, solder mask strategy, component keep-outs, and routing considerations.
  • Provide clear, data-driven feedback to influence design decisions early in development.
  • Author and maintain board-level assembly design guidelines for internal teams and external manufacturing partners.
• Cross-Functional and Supplier Collaboration
  • Act as a technical bridge across design engineering, reliability, mechanical/thermal, quality, and global manufacturing teams.
  • Lead technical engagements with contract manufacturers, material suppliers, and equipment vendors.
  • Drive root-cause analysis and corrective actions for complex yield and reliability issues using engineering rigor and data.

PREFERRED EXPERIENCE:

• Extensive hands-on SMT process development experience for high-complexity PCB assemblies.
• Demonstrated ownership of large BGA assembly challenges, including warpage, coplanarity, thermal behavior during reflow, and post-assembly stability.
• Proven track record of developing processes that transition successfully from engineering builds to high-volume manufacturing.
• Experience working directly with global manufacturing partners and equipment vendors to qualify capability and drive improvements.
• Strong background in structured problem solving (DOE, statistics, root-cause analysis) for yield and reliability issues.
• Experience or knowledge on Reliability Qualification (Board Level) for high-complexity PCB assemblies for temp cycling, random/sine vibration, mechanical shock and failure analysis.
• Experience with advanced reflow capabilities (vacuum/inert atmosphere) and void reduction strategies.
• Experience developing board-level mechanical robustness processes (edge bond/underfill) for demanding environments.
• Experience defining and implementing rework strategies for complex assemblies while maintaining reliability requirements.

Technical Expertise

• Deep knowledge of SMT processes: printing/stencil, placement, reflow, and post-reflow stabilization.
• Strong understanding of BGA solder joint formation, defect mechanisms, and reliability drivers.
• Practical experience with warpage measurement methods and thermal profiling approaches.
• Working familiarity with relevant industry standards (e.g., IPC and J-STD) and the ability to apply them pragmatically.

Software/Tools Skills

• Statistical & DOE Tools: Minitab, JMP, or equivalent for Design of Experiments and statistical analysis.
• Mechanical CAD: SolidWorks, or AutoCAD for mechanical analysis.
• CAD Tools: Mentor Graphics, Cadence Allegro or Pentalogix for PCB DFM and layout review.

Leadership & Communication Skills

• Ability to operate as a technical authority without direct people management and influence cross-functional decisions.
• Strong written and verbal communication skills, including authoring technical guidelines and presenting complex topics to diverse audiences.
• Comfortable challenging assumptions and driving alignment through data and engineering judgment.

ACADEMIC CREDENTIALS:

• Bachelor's with at least 10 years or Master's degree with at least 7 years of experience in manufacture Engineering, Mechanical Engineering, Materials Science, or a related discipline.

LOCATION:

Taipei, Taiwan

• #LI-SC1

Benefits offered are described:  AMD benefits at a glance.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law.   We encourage applications from all qualified candidates and will accommodate applicants' needs under the respective laws throughout all stages of the recruitment and selection process.