Sr. Packaging Engineer Job Listing at AMD in Hsinchu (Job ID 68065-en-us)

Description

WHAT YOU DO AT AMD CHANGES EVERYTHING

We care deeply about transforming lives with AMD technology to enrich our industry, our communities, and the world. Our mission is to build great products that accelerate next-generation computing experiences – the building blocks for the data center, artificial intelligence, PCs, gaming and embedded. Underpinning our mission is the AMD culture. We push the limits of innovation to solve the world's most important challenges. We strive for execution excellence while being direct, humble, collaborative, and inclusive of diverse perspectives. 

AMD together we advance_

THE ROLE: 

We are looking for a candidate that can drive supplier engagement with external manufacturer/material suppliers on delivering key performance indices in terms on New Product Introduction, Supplier Manufacturing readiness, Excursion free processes, Value Engineering and Enabling new capabilities. AMD's environment is fast paced, results oriented and built upon a legion of forward-thinking people with a passion for winning technology!  

THE PERSON: 

The successful candidates must be a team player with a commitment to meeting deadlines, have a drive for solutions and an aptitude to thrive with the ability to work in a fast-paced multi-tasking environment. He or she would have excellent cross functional project management skills, conflict management skills, strong interpersonal skills with good executive presentation & communication skills. Demonstrating strong leadership to excel in his/her work with minimum supervision and strong interest to grow in people management ladder. 

KEY RESPONSIBILITIES: 

• Package related structure stress analysis including warpage and material study
• Package and board level stress modeling and prediction
• IC and package thermal analysis, modeling, and characterization
• Chip-Package-PCB thermal co-simulation and design solution recommendations 
• System level thermal simulation
• System level stress simulation

PREFERRED EXPERIENCE: 

• Strong knowledge in FCBGA/2.5D/3D package structure design  
• Familiar with package thermal characterization modeling and validation flow
• Familiar with package stress modeling, reliability test, and its corresponding failure mode
• Experience on system level modeling is a plus
• Required capability in EDA tool : ANSYS Icepak, AEDT-Icepak, SCDM, Mentor Flotherm, ANSYS Mechanical tool

ACADEMIC CREDENTIALS: 

• MS degree in Mechanical or Material or Chemical Engineering 

#LI-SC1 

Benefits offered are described:  AMD benefits at a glance.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law.   We encourage applications from all qualified candidates and will accommodate applicants' needs under the respective laws throughout all stages of the recruitment and selection process.